Tempress SPECTRUM PECVD is a batch-type PECVD system for SiOx and SiNx deposition on silicon solar cells. It uses the benefits of a direct plasma system while maintaining good color uniformities. The Tempress SPECTRUM has the highest throughput available in the market.
The Tempress SPECTRUM LPCVD Poly system is used for in-situ oxide and poly deposition in a so-called ‘TopCon’ solar cell. The system is capable of depositing both undoped and in-situ doped polysilicon, with uniform deposition over the entire batch. The SPECTRUM LPCVD system allows the ‘TopCon’ process flow to be run with high throughput and low cost of ownership, as is demonstrated by Tier 1 customers that use the system in high volume manufacturing.