Production furnace systems

Over the past 45 years, Tempress has built up an world wide installed base of over 1800 furnace systems. Most of these systems are dedicated for the Semiconductor industry. During this long history, Tempress was able to built up extensive hardware and process know-how. The TS 6 & TS 8 series medium & high volume production furnace systems are dedicated for 100 mm up to 200 mm wafers

Systeem vrijstaand1(2)Key system features

  • 4 tube furnace with flat zones of 600 – 1100 mm
  • Temperature range available 380 – 1350°C
  • Optional fast cool down system, for controlled ramp down range 0 – 20°C /min., which reduces the process time
  • Automatic loading by Cantilever or Softlander system.
  • Wafer handling system available: S300 automatic full batch elevator system can be interfaced with:
    • Cassette to cassette loading system
    • Smif loading system
    • Wafer transfer systems
  • Back mounted and L shaped gas source cabinet available
  • High quality, performance and full process support
  • Control system consisting of:
    • Digital Process Controller (DPC)
    • Digital Temperature Controller (DTC)
    • Color TFT touchscreen
  • Tempress Data Management System (TSC system)

 

Typical processes

Diffusion

  • Oxide
  • POCl3
  • BBr3
  • Solid Source doping
  • Sintering / Alloying
  • Annealing / Drive-In

Deposition

  • Poly Silicon (Flat-ramped-doped)
  • SIPOS
  • PECVD
  • LPCVD, SiN, Oxide
  • TEOS (BPSG)
  • LTO (BPSG)
  • HTO
  • Tantal Oxide