Tempress launches VS Series vertical furnace platform Today, Tempress launches the VS Series vertical furnace platform on the Semicon Europe show in Munich. The VS series is an economical and small footprint solution for smaller batch (1 to 75 wafers) wafer...
Valencia, Spain, and Vaassen, The Netherlands – UPVfab, the microfabrication facility at the Universitat Politècnica de València, has upgraded the low-pressure chemical vapor deposition (LPCVD) furnace on its system TS81003 manufactured by Tempress, to expand...
Semicon Taiwan 14 – 16 September 2022 | TaiNEX 1, Taipei Tempress at Semicon Taiwan, 14 – 16 September 2022 Our Taiwanese team from Kromax International will represent Tempress at Semicon Taiwan in September 2022. You are kindly invited to visit us at...
Flower and insect garden At the Tempress Vaassen site. Flower and insect garden at our Tempress Vaassen site When Ellie Mulder, working in our financial department, saw the beautiful flower and insect garden at our neighbours at Droste she was determined to make this...
An ode to Barcelona. The Institute of Microelectronics of Barcelona (IMB-CNM, CSIC) The Institute of Microelectronics of Barcelona (IMB-CNM, CSIC) The Institute of Microelectronics of Barcelona (IMB-CNM, CSIC) is the largest institute in Spain dedicated to the...
A new launch Tempress launches the TS Series V multipurpose thermal processing platform, providing ultimate process flexibility (diffusion, LPCVD, PECVD and ALD) within optimized cleanroom footprint. The TS Series V can process wafer sizes up to 300 mm and can be...
