Tempress and R2D are happy to announce the shipment of a fully automated diffusion furnace system to a Tier1 customer in Asia. The Tempress high temperature diffusion TS-Series furnace is combined with a field proven R2D COMET-LISA wafer transfer system, a standard SMIF pod opener and a reliable robot for placing boats on paddles. This combination results in improved stability, flexibility and a higher throughput solution for our customers’ horizontal diffusion furnaces. The new automation setups are immediately available with SMIF/FOUP pod openers for 200/300 mm projects with SECS-GEM host interface communication. With continued automation requirements in the high temperature diffusion segment in semiconductors, Tempress and R2D expect significant order intake for new factory expansions as well as factory automation upgrades.
Tempress and R2D ship first TS-Series furnace with fully automated wafer handler
