Tempress launches VS Series vertical furnace platform
Today, Tempress launches the VS Series vertical furnace platform on the Semicon Europe show in Munich. The VS series is an economical and small footprint solution for smaller batch (1 to 75 wafers) wafer processing. It offers a wide range of diffusion and deposition processes and allows for easy and cost-effective integration in R&D, pilot and full production environments.
“The VS Series is designed around the concept of smart flexibility”, says Pieter de Groot, managing director and CEO. “Flexibility in wafer size facilitates 150mm, 200mm or even 300mm wafer processing. Flexibility in batch size allows for economically processing small batches of R&D wafers while maintaining scalability towards high volume manufacturing with up to 75 process wafers in one batch on the same processing platform. And flexibility in wafer handling makes that the system can be configured with manual loading, automatic cassette-to-cassette loading or fully automatic loading including integration in an OHT system.”
Tempress’ purpose is to support customers in the semiconductors, power, MEMS, photonics, solar, life sciences and coating markets to produce advanced materials and devices with high added value innovative furnace solutions. Tempress’ over 50 years of heritage in developing and producing diffusion and deposition equipment and related processes is a testament to the company’s flexibility, innovation, quality, and dedication.
Our technologies and products have advanced the semiconductor industry and we have installed more than 30 GW production capacity in diffusion furnace systems for solar panel production. Tempress’ headquarters is located in Vaassen, The Netherlands. Customers are supported throughout the world by its highly professional direct sales and service people and commercial partner network.
Find out more about Tempress at our LinkedIn-page (https://www.linkedin.com/company/tempress-systems).