Tempress launches VS Series vertical furnace platform
Today, Tempress launches the VS Series vertical furnace platform on the Semicon Europe show in Munich. The VS series is an economical and small footprint solution for smaller batch (1 to 75 wafers) wafer processing. It offers a wide range of diffusion and deposition...
UPVfab silicon nitride LPCVD systems up to 8 inch wafers upgraded for low stress films
Valencia, Spain, and Vaassen, The Netherlands - UPVfab, the microfabrication facility at the Universitat Politècnica de València, has upgraded the low-pressure chemical vapor deposition (LPCVD) furnace on its system TS81003 manufactured by Tempress, to expand the...
A new launch
Tempress launches the TS Series V multipurpose thermal processing platform, providing ultimate process flexibility (diffusion, LPCVD, PECVD and ALD) within optimized cleanroom footprint. The TS Series V can process wafer sizes up to 300 mm and can be configured for a...
Tempress and R2D ship first TS-Series furnace with fully automated wafer handler
Tempress and R2D are happy to announce the shipment of a fully automated diffusion furnace system to a Tier1 customer in Asia.
Fully automated wafer handler
Tempress and R2D are happy to announce the shipment of a fully automated diffusion furnace system to a Tier1 customer in Asia. The Tempress high temperature diffusion TS-Series furnace is combined with a field proven R2D COMET-LISA wafer transfer system, a standard...
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