TS Series V

The Multipurpose Thermal Processing Platform

One Furnace – Multiple processes

  • Range of processes combined in one tool.
  • Modular designed.
  • Upgradable, configurable hard- and software.
  • Extended process capabilities and improvements.

Atomic Layer Deposition

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Low Pressure Chemical Vapor Deposition

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Diffusion

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Plasma Enhanced Chemical Vapor Deposition

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Features

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High uptime and process availability

  • Shorter repair times.
  • Use of high quality, industrial components
  • Support in process optimization
  • Easy acces to Tempress expert knowledge

Easy to integrate into existing infrastructure

Flexible and customized integrated automation options including Cassette-to-Cassette

  • Flexible interface between automation and furnace
  • Integrated 6 axis robot for wafer transfer
  • Proven wafer transfer system (installed base 500+)
  • Supporting 150-300 mm wafers

Extra options:

    • Notch aligning
    • Storage/buffer positions
    • ESD combs
    • Ionizer
    • Automatic Foup or SMIF opening
    • OHT interface
    • SECS/GEM E30 or SEMI 300
    • Edge contact or vacuum end effector
    • Batch transfer or single transfer

Easy operation and high security

New advanced NTM furnace controller and software delivers:

  • Easy formulation and adaptation of process recipes and distribution over different furnaces without advanced programming skills
  • Data logging allowing improved feedback loops and improved process quality and yield
  • New touch screen user interface intuitive and easy to use for operators and process technologists
  • Improved user management allowing easy operation, protection against flaws and improved security
  • One UI (User Interface) to control the entire furnace, process, recipe editing, control and monitor motions, boat movements, logging and analyses process variables and overview of the machine user interface

System Characteristics

TS 6-8-12 Horizontal batch furnaces

# stacks 2 to 4 (2 or 3 fot TS12)
Wafer size 150-300 mm
Cleanroom ISO 4 compatible

Temperature

Flatzone

300 – 1000 mm TS6 within ±0,5 °C

600-1250mm TS8 within ±0,5 °C

800-1000 mm TS12 within ±0,5 °C

Control Cascade PID, accuracy ±0,1 °C
Maximum 1300°C process
Optional Fast cooldown (TS8 and TS12)

Address

Radeweg 31
8171 MD, Vaassen