Our horizontal and vertical furnace solutions help pioneers in the More than Moore segments of the semiconductor industry who want to develop and deploy diffusion and deposition processes for all wafer sizes, up to 300mm wafers.
From power devices and MEMS to photonics, advanced packaging and LED, our diffusion and deposition solutions are qualified in production and pilot lines worldwide.
Modular horizontal stacks and vertical batch processors, configured around your process, footprint and throughput.
Complete thermal processes developed over six decades and proven in production fabs worldwide.
Diffusion processes modify the electrical properties of wafer material by introducing dopant atoms from a chemical vapor source or by annealing crystal defects. Tempress offers high-temperature annealing up to 1365°C, wet and dry oxidation, phosphorus and boron doping with POCl3 and BBr3, plus lower-temperature sintering, alloying and annealing with up to 100% H2.
Deposition processes produce thin films of high-quality solid materials on a wafer. Tempress offers Low Pressure CVD (LPCVD) for improved uniformity, Plasma Enhanced CVD (PECVD) for lower-temperature processing with higher deposition rates, and Atomic Layer Deposition (ALD) for ultra-thin, conformal films with atomic-level thickness control.
