The spirit of progress.
Tempress deposition and diffusion solutions are used by leading companies in the semiconductor and advanced materials industry. Applications range from wafer manufacturing to MEMS, optoelectronic chip and power semiconductor production. Our solutions also play into non-wafer applications such as production of nano-materials that enhance performance of cathodes for EV batteries or coatings for membranes to clean waste streams.
Diffusion processes are used in semiconductor manufacturing to modify the electrical properties of the wafer material, typically by introducing dopant atoms into the wafer material from a chemical vapor source or by annealing the crystal defects. Tempress offers a wide range of diffusion processes from high temperature annealing (up to 1365°C ), wet and dry oxidation and Phosphorus and Boron doping with POCI3 and BBr3, to lower temperature (<500°C) sintering, alloying and annealing with up to 100% H2.
Deposition (CVD/ALD) processes are used to produce (thin) films of high quality and high-performance solid materials on a wafer. Typical applications can be found in the production of integrated circuits (ICs), micromechanical structures (MEMS), photonic devices and photovoltaic (solar cell) systems. Tempress offers Low Pressure CVD (LPCVD), that reduces unwanted gas-phase reactions and improves uniformity of the film across the wafer, Plasma Enhanced CVD (PECVD), allowing deposition at lower temperatures with increased deposition rates and Atomic Layer Deposition (ALD) for producing very thin, conformal films with control of the thickness and composition of the films possible at the atomic level.
Tempress offers a multipurpose thermal processing platform that enables you to use a wide range of (semiconductor) diffusion and deposition technologies.
TS Series V.
The TS Series V exceeds everything you expect it to be
The horizontal furnace TS series V is optimized for flexibility, multiple processes and cleanroom space. With its modular design the TS series V is available with up to four furnace stacks that can independently and simultaneously run a multitude of processes.
Smaller batches, latest technology!
Do you want to process smaller batches of wafers and do not want to compromise on quality of your deposition or diffusion process? The vertical furnace VS Series is your tool of choice!
We love it when a plan comes together.
“If you have a problem, if no one else can help, and if you can find them….maybe you can hire The T-Team.”
We believe that semiconductor technologies are critical to develop solutions to keep the world clean, connected and healthy.
We deliver deposition technologies to produce devices that enable the electrification of our transport, that connect people and things (IoT) and that improve health
we believe in absolute integrity.
we believe in teamwork and keeping our promises.
we believe in being bold and positive.
Tempress launches VS Series vertical furnace platform
Today, Tempress launches the VS Series vertical furnace platform on the Semicon Europe show in Munich. The VS series is an economical and small footprint solution for smaller batch (1 to 75 wafers)...
UPVfab silicon nitride LPCVD systems up to 8 inch wafers upgraded for low stress films
Valencia, Spain, and Vaassen, The Netherlands - UPVfab, the microfabrication facility at the Universitat Politècnica de València, has upgraded the low-pressure chemical vapor deposition (LPCVD)...
Semicon Taiwan 2022
Tempress will be present at Semicon Taiwan (14-16 September 2022).
- Radeweg 31, 8171 MD, Vaassen