Tempress deposition and diffusion solutions are used by leading companies in the semiconductor and advanced materials industry. Applications range from wafer manufacturing to MEMS, optoelectronic chip and power semiconductor production. Our solutions also play into non-wafer applications such as production of nano-materials that enhance performance of cathodes for EV batteries or coatings for membranes to clean waste streams.

Deposition.

Deposition (CVD/ALD) processes are used to produce (thin) films of high quality and high-performance solid materials on a wafer. Typical applications can be found in the production of integrated circuits (ICs), micromechanical structures (MEMS), photonic devices and photovoltaic (solar cell) systems. Tempress offers Low Pressure CVD (LPCVD), that reduces unwanted gas-phase reactions and improves uniformity of the film across the wafer, Plasma Enhanced CVD (PECVD), allowing deposition at lower temperatures with increased deposition rates and Atomic Layer Deposition (ALD) for producing very thin, conformal films with control of the thickness and composition of the films possible at the atomic level.